Test Module Development Engineer

Intel

3 days ago

3.7 on Glassdoor

Phoenix, AZ

Onsite

Full Time

Senior

0 applicants

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About this role

Intel's Advanced Packaging Technology Manufacturing group is focused on pioneering next-generation semiconductor packaging solutions, including 3D packaging, chiplet integration, and high-performance packaging for AI and data centers. The role involves developing testing technologies and processes to support innovative packaging designs and enable industry leadership in advanced semiconductor solutions.

Skills

Qualifications

Bachelor's degree in engineering, physics, chemistry or related STEM field, 6+ years experienceMaster's degree in engineering, physics, chemistry or related STEM field, 4+ years experiencePh.D. in engineering, physics, chemistry or related field

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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