Wafer Bond Process Development Engineer

Eightfold(25 days ago)

Boise, IDOnsiteFull TimeSenior$114,488 - $155,355 (estimated)Process Engineering

About this role

A Process Engineer on Micron’s Wafer Bonding team develops and implements process technology to meet DRAM roadmap requirements. The role focuses on enabling and improving wafer bonding performance through collaboration with process integration, equipment, and manufacturing teams. The position supports career growth into an expert engineering role influencing semiconductor manufacturing roadmaps.

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Required Skills

Wafer Bonding
Photolithography
Wet Process
Thin Films
Wafer Thinning
Process Development
Process Integration
SPC
Recipe Management
Problem Solving

+3 more

Qualifications

BS in Materials Science
MS in Materials Science
PhD in Materials Science
BS in Chemical Engineering
BS in Electrical Engineering
BS in Mechanical Engineering
BS in Chemistry
BS in Physics

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