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© All Rights Reserved. ApplyBlast.com
HP
HP is seeking a Process Engineer to provide technical leadership for wafer bonding technologies supporting high-volume manufacturing and next-generation MEMS product development. The role involves sustaining existing processes, leading the development and qualification of new bonding technologies, and driving manufacturing excellence through cross-functional collaboration. The successful candidate will serve as the technical owner for wafer bonding processes, partnering with Operations, Equipment Engineering, and external suppliers to advance operational performance.
Learn about HP laptops, pc desktops, printers, accessories and more at the Official HP® Website.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for HP.
4% below the average for this role
Nov 25, 2025
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