Oracle
The Wire Bond Equipment Engineer plays a pivotal role in a vibrant manufacturing team, focusing on the evaluation, selection, and maintenance of wire bond equipment to optimize production. This position involves overseeing equipment installation, upgrades, and preventative maintenance while providing technical support to ensure manufacturing process reliability. The role requires strong analytical skills and collaboration within a fast-paced semiconductor environment.
Oracle Corporation is a multinational technology company that builds enterprise software, cloud infrastructure, and engineered systems for large organizations. Best known for the Oracle Database, the company also offers a broad portfolio of enterprise applications (ERP, HCM, CX), analytics, middleware, Java, and hardware, plus Oracle Cloud Infrastructure (OCI) with SaaS, PaaS, and IaaS services. Oracle supports customers through consulting, managed services, and global technical support to migrate and modernize mission‑critical systems. Enterprises choose Oracle for its integrated stack, scalable performance, and enterprise‑grade security and reliability.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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