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© All Rights Reserved. ApplyBlast.com
Skyworks Solutions
Join Skyworks' Advanced IC Packaging team to develop advanced semiconductor packaging technologies for wireless products. You will lead thermal and mechanical simulation efforts, influence package design decisions, and work with cross-functional teams to deliver reliable, high-performance packaging solutions. The role involves creating detailed thermo-mechanical finite element models, performing reliability simulations, and collaborating with internal and external teams to improve package performance and manufacturability.
Headquarters
Irvine, California, United States
Company Size
5001-10000 employees
Founded
1962
Skyworks Solutions is a semiconductor company that designs and manufactures a broad portfolio of analog and mixed-signal semiconductors, including amplifiers, front-end modules, filters, switches, isolators, power management ICs, and timing solutions. Their products support a wide range of wireless and wired technologies such as 5G, Wi-Fi, Bluetooth, GPS, and IoT across markets including mobile, automotive, aerospace, data centers, and industrial. Skyworks serves applications from consumer electronics to wireless infrastructure under the mission of connecting everyone and everything.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Skyworks Solutions.
Skyworks Solutions didn’t post a salary, so this is our estimate from similar listings.
5% below the average for this role
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