Principal Package Design Engineer

Renesas Electronics is seeking a senior-level engineer to lead the design, development, and qualification of advanced semiconductor packaging solutions, including flip‑chip, wafer‑level, 2.5D/3D, and system‑in‑package architectures. The role involves cross‑functional collaboration with design, manufacturing, suppliers, and quality teams to ensure package performance, reliability, and manufacturability for high‑performance and power semiconductor products.