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Advanced Packaging Technology Integration Leader at Applied Materials - ApplyBlast

Advanced Packaging Technology Integration Leader

Applied Materials

5 days ago

3.9 on Glassdoor

Santa Clara, California, United States

Onsite

Full Time

Senior

0 applicants

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About this role

The Advanced Packaging Technology Integration Leader will lead the development of next-generation semiconductor packaging and 3D integration technologies. This role requires deep technical expertise in semiconductor process integration, hybrid bonding, TSVs, and heterogeneous integration to drive innovation from first principles. The leader will guide cross-functional teams, establish technology roadmaps, and engage with industry partners to address future AI/HPC and memory architecture challenges.

Responsibilities

Lead development of next-generation semiconductor packaging and 3D integration technologies
Develop differentiated packaging technologies from first principles and establish technology roadmaps
Lead multidisciplinary teams and engage with customers to define technology-development programs

Skills

About Applied Materials

appliedmaterials.com

Headquarters

Santa Clara, California, United States

Company Size

10001+ employees

Founded

1967

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Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.