Nexperia
The Die Bond Process Staff Engineer leads and manages all Die Attach/Die Bond manufacturing processes to achieve world-class quality, yield, and reliability. This role involves process development, optimization, and qualification while ensuring robust process control and successful new product introduction. The position requires leading a team of Process Engineers and collaborating with cross-functional partners to drive operational excellence.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Nexperia.
Nexperia didn’t post a salary, so this is our estimate from similar listings.
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2 days ago
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