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© All Rights Reserved. ApplyBlast.com
3dgsinc
The Group Leader – Die Attach & Underfill leads the development, optimization, and qualification of flip chip die attach and underfill processes for advanced semiconductor assembly. This role focuses on achieving robust interconnect performance, defect reduction, and high manufacturing yield while managing cross-functional engineering activities and building the module team. The position involves establishing a qualified and scalable die attach and underfill module for various product families.
Headquarters
Albuquerque, New Mexico, United States
Company Size
51-200 employees
Founded
2006
3DGS (3D Glass Solutions) manufactures glass substrates and interposers for advanced packaging and 3D heterogeneous integration, enabling high-frequency RF, photonics, and HPC systems. We provide high-performance fused silica glass solutions and onshore foundry services for commercial, aerospace/defense, and government customers, with ITAR-compliant manufacturing and RAD HARD qualifications. Our substrates support applications from automotive radar and 5G/6G infrastructure to LiDAR, quantum photonics, and chiplet-enabled data centers.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for 3dgsinc.
3dgsinc didn’t post a salary, so this is our estimate from similar listings.