Director Heterogenous Integration Advance Packaging Santa Clara Ca

Applied Materials

26 days ago

3.9 on Glassdoor

Santa Clara, CA

Onsite

Full Time

Senior

0 applicants

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About this role

A semiconductor packaging engineer at Applied Materials specializing in advanced packaging modules related to logic, DRAM, or NAND devices. The role involves developing new materials and processes, driving innovation in hybrid and fusion bonding, and working within a global, cross-functional team.

Skills

Qualifications

BS/MS in Electrical Engineering, Mechanical Engineering, Material Engineering

About Applied Materials

appliedmaterials.com

Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.