Advanced Packaging Development Engineer
Broadcom(1 month ago)
About this role
This role focuses on developing advanced semiconductor packaging technologies, particularly 2.5D/3D packaging. The position centers on driving technology innovation and enabling new packaging solutions while working within a collaborative engineering environment. A PhD in a related engineering field is preferred.
Required Skills
- Advanced Packaging
- 2.5D Packaging
- 3D Packaging
- Technology Development
- Technology Innovation
- Project Management
- Team Collaboration
Qualifications
- PhD in Engineering
About Broadcom
broadcom.comBroadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.
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