Engineer, Thermal Mechanical Simulation
micron
About this role
A Packaging Design Engineer at Micron Technology focuses on semiconductor packaging technologies, simulation analysis, and material characterization to support package development and manufacturing processes.
Skills
About micron
micron.comMicron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.
About micron
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for micron.
Salary
$128k – $187k
per year
More jobs at micron
Similar Jobs
FEA Simulation Engineer (Thermal)
Monolithic Power Systems
Applied AI and Simulation Engineer (Packaging Engineering)
Mapleview Family Dentistry
Thermal Compression Bonding Development Engineer
Intel
Process Engineer III
Applied Materials
Staff/Principal FEA Simulation Engineer (Stress)
Monolithic Power Systems
Semiconductor Packaging Mechanical Engineer
Intel