Thermal Compression Bonding Development Engineer

Intel

9 days ago

3.7 on Glassdoor

Malaysia, Kedah

Onsite

Full Time

Junior

0 applicants

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About this role

A Packaging Module Development Engineer at Intel focuses on developing and optimizing thermal compression bonding processes for advanced packaging technologies. The role contributes to the quality, reliability, and manufacturability of semiconductor packages through experimentation, data analysis, and collaboration.

Skills

Qualifications

Bachelor's Degree in Mechanical EngineeringBachelor's Degree in Materials EngineeringBachelor's Degree in Electrical EngineeringBachelor's Degree in Electronic EngineeringBachelor's Degree in Chemical Engineering

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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