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© All Rights Reserved. ApplyBlast.com
TOPPAN Packaging Americas
The Engineering Emerging Leader Program (ELP) at TOPPAN Packaging Americas provides recent engineering graduates with a structured, on‑site experience in a manufacturing environment. Participants receive technical, leadership, and business training while contributing to mechanical/electrical projects, process improvements, and capital initiatives.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for TOPPAN Packaging Americas.
TOPPAN Packaging Americas didn’t post a salary, so this is our estimate from similar listings.
13% below the average for this role