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© All Rights Reserved. ApplyBlast.com
UTAC
The Underfill Process Development Engineer develops, optimizes, qualifies, and sustains underfill processes for advanced semiconductor packaging technologies. The role involves process characterization, material evaluation, reliability improvement, yield enhancement, and equipment optimization across flip chip, SiP, and advanced package assemblies.
Accelerate your automotive innovation with UTAC. We provide comprehensive testing, certification, and engineering services across our global network of facilities.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for UTAC.
UTAC didn’t post a salary, so this is our estimate from similar listings.