Cisco Systems, Inc.
The Hardware ASIC Packaging SI/PI Simulation and Design Lead role involves developing and verifying next-generation ASIC packaging for Cisco platforms, ensuring power, performance, and area goals are met. The position requires analyzing signal and power integrity, collaborating with layout teams, and mentoring engineering staff to drive continuous improvement. This role focuses on shaping groundbreaking solutions by designing complex ASICs for high-volume release.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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