Micron Technology
A SoC Physical Design Engineer at Micron Technology drives the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. The role involves working closely with multiple teams to deliver best-in-class PPA and robust signoff collateral for tape-out.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Micron Technology.
Principal Physical Design Engineer
Analog Devices
Physical Design Engineer Senior Austin Texas United States Of America
Qualcomm Incorporated
Physical Design Engineer
Ambarella
Physical Design Engineer Senior To Staff Level Taipei Taipei City Taiwan
Qualcomm Incorporated
Physical Design Tech Lead/Engineer
Altera
Physical Design Engineer
Altera