Micron Technology
The HBM SoC Physical Design Engineer drives the implementation of advanced HBM SoC logic and base die designs from netlist to GDSII. This hands-on role involves collaborating with cross-functional teams to deliver best-in-class performance, power, and area (PPA) while integrating AI-driven tools into workflows. The position focuses on physical implementation, timing closure, and signoff for complex SoC blocks and top-level integration.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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25% above the average for this role