IC Package Engineer (Starlink/Akoustis)
SpaceX(1 month ago)
About this role
The IC Package Engineer will lead development, qualification, and implementation of advanced integrated circuit packaging solutions to enable high-reliability, high-performance electronics for Starlink/Akoustis. The role partners cross-functionally with design, manufacturing, reliability, supply chain, and failure analysis teams to deliver optimized semiconductor packages that meet stringent thermal, mechanical, and electrical requirements. The position supports qualification testing, failure investigations, and production readiness for a variety of package types and materials. This role contributes directly to SpaceX’s mission through in-house engineering and production of RF filter and satellite electronics technologies.
Required Skills
- Flip-Chip
- Wire Bonding
- WLP
- QFN
- CSP
- LGA
- Materials Selection
- Thermal Management
- Reliability Testing
- AutoCAD
+18 more
Qualifications
- Bachelor's Degree in Engineering
- ITAR Eligibility (U.S. Citizen or Permanent Resident)
About SpaceX
spacex.comSpaceX is an aerospace manufacturer and launch services company that designs, manufactures, and launches advanced rockets and spacecraft. Founded in 2002 to revolutionize space technology and ultimately enable human life on other planets, it developed the Falcon 9 and Falcon Heavy rockets, the Dragon crew/cargo spacecraft, and the next‑generation Starship — with a strong emphasis on reusable boosters. SpaceX provides commercial and government launch services (including crewed ISS missions, satellite deployments and rideshares) and operates the Starlink broadband constellation. The company is known for rapid iterative development and cost‑reduction through reuse to expand access to space.
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