IC / Semiconductor Package Designer

Broadcom(2 months ago)

HybridFull TimeSenior$120,000 - $192,000Hardware Engineering

About this role

Broadcom is hiring an experienced IC/Semiconductor Package Designer to develop next-generation package architecture and bring advanced-node silicon products (7nm and below) to production. The role partners closely with chip, system, and manufacturing stakeholders to deliver industry-leading packaging solutions and support productization through high-volume manufacturing.

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Required Skills

IC Packaging
Package Architecture
Substrate Design
BGA Design
Flip Chip
Bump Design
Floorplanning
Signal Integrity
Power Integrity
Thermal Management

+12 more

Qualifications

BS in Electrical Engineering
MS in Electrical Engineering
PhD in Electrical Engineering
BS in Mechanical Engineering
MS in Mechanical Engineering
PhD in Mechanical Engineering
BS in Materials Science
MS in Materials Science
PhD in Materials Science

About Broadcom

broadcom.com

Broadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.

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