HCL Group
The role involves designing and architecting IC packages with expertise in Cadence Advanced Package Designer, high‑speed interfaces, and various package technologies such as flip chip, MCM, 2.5D/3D. The engineer will lead tape‑out efforts, ensure compliance with design rules, and mentor the team on advanced package layout and performance requirements.
HCL Group is a pioneering Indian conglomerate established in 1976, recognized as one of India's original IT garage start-ups and an early innovator in modern computing. The Group operates a portfolio of companies spanning technology services (HCLTech), software products (HCLSoftware), healthcare solutions (HCL Healthcare), IT distribution (HCL Infosystems), and online education (HCL GUVI). It also invests in philanthropy, sports, and music through various strategic programs and foundations.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for HCL Group.
HCL Group didn’t post a salary, so this is our estimate from similar listings.
5% below the average for this role
Principal IC Package Design Engineer
Cadence Solutions
Advanced Packaging Senior Engineer
marvellsemiconductor.com
Package Design Engineer Up To Staff Level Santa Clara California United States Of America
Qualcomm Incorporated
IC Package-Design Engineer
Broadcom
IC / Semiconductor Package Designer
Broadcom
Package Design Engineer
Broadcom