Lightmatter
The Lead Package Integration Engineer will drive development of advanced semiconductor laser modules and define the packaging roadmap for next-generation photonic computing platforms. This role leads a multi-disciplinary technical team to bridge chip-level design and system-level integration for high-performance AI and HPC data center hardware. The position sits at the intersection of traditional semiconductor packaging and silicon photonics and supports scaling to high-volume manufacturability.
Headquarters
Mountain View, California, United States
Company Size
51-200 employees
Founded
2017
Lightmatter is a photonic (super)computer company that merges photonics and computing to rethink the limits of AI. The company designs photonic interconnect chips — including its Passage co-packaged optics platform and Guide VLSP light engine — to deliver high-bandwidth, energy-efficient networking for large-scale AI supercomputers and data centers. Its products enable massive GPU cluster scaling for frontier AI training and inference workloads by overcoming the bandwidth limitations of conventional electrical interconnects.
Lightmatter unveils Passage L20 photonic interconnect, announces vClick Optics offering for high-volume CPO manufacturing
16 hours ago
Lightmatter Unveils vClick Optics Detachable Fiber Array Unit for CPO Advanced Packaging and High-Volume Production
1 day ago
Photonic Computing Leader Lightmatter Raises $400M | Industry News | Jan 2025
Sep 26, 2025
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Lightmatter.
Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers
1 month ago
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