Lead Package Assembly Integration Engineer (Laser Modules)

Lightmatter(12 days ago)

HybridFull TimeSenior$193,000 - $262,000Packaging Engineering

About this role

The Lead Package Integration Engineer will drive development of advanced semiconductor laser modules and define the packaging roadmap for next-generation photonic computing platforms. This role leads a multi-disciplinary technical team to bridge chip-level design and system-level integration for high-performance AI and HPC data center hardware. The position sits at the intersection of traditional semiconductor packaging and silicon photonics and supports scaling to high-volume manufacturability.

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Required Skills

Semiconductor Packaging
Thermal Simulation
Mechanical Analysis
Optical Alignment
Flip Chip
Wirebond Integration
Substrate Design
Fiber Attach
DOE
Reliability Testing

+2 more

Qualifications

MS or PhD in Mechanical Engineering, Materials Science, or Electrical Engineering

About Lightmatter

lightmatter.co

Lightmatter is a photonic (super)computer company that merges photonics and computing to rethink the limits of AI. They design photonic processors and full-system accelerators intended to deliver substantially higher speed and energy efficiency for AI workloads than conventional electronic approaches. Their platform combines hardware and supporting software to help AI developers and data centers run inference and training more quickly and cost‑effectively.