ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION
Eightfold
About this role
This role is an early-career engineering position supporting silicon integration for next-generation memory products at Micron. It offers structured learning and collaboration opportunities across various teams involved in semiconductor packaging and manufacturing.
Skills
About Eightfold
eightfold.aiMaximize your workforce's potential with our advanced AI Talent Intelligence Platform for talent acquisition and development. Unlock the full potential of your workforce today.
Recent company news
ReutersAI company Eightfold sued for helping companies secretly score job seekers
Jan 21, 2026
Yahoo FinanceAI company Eightfold sued for helping companies secretly score job seekers
Jan 21, 2026
The New York TimesJob Applicants Sue to Open ‘Black Box’ of A.I. Hiring Decisions
Jan 21, 2026
FortuneJob seekers are suing an AI hiring tool used by Microsoft and Paypal
1 month ago
Built InAI Hiring Under Fire: The Eightfold Lawsuit Explained
1 month ago
About Eightfold
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for Eightfold.
Salary
$51k – $69k
per year
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