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© All Rights Reserved. ApplyBlast.com
infineon
This role leads physical design and timing closure for complex low-power SoCs targeting IoT and MCU applications, managing end-to-end implementation from floor planning to final signoff. The position requires driving optimization of die area, timing, power, and performance while ensuring successful convergence across multiple operating modes and PVT corners. The role involves collaborating with cross-functional teams to resolve implementation challenges and mentoring engineers to promote technical excellence.
Infineon Technologies is a global semiconductor company that delivers chips and system solutions for automotive, industrial, IoT, and consumer markets. Its product portfolio includes microcontrollers, sensors, power-management ICs and power semiconductors (e.g., MOSFETs/IGBTs), memories, connectivity (USB, Bluetooth, Wi‑Fi), LED drivers, security controllers and radiation‑hardened devices. Infineon focuses on energy efficiency, safety and security to enable applications from electric vehicles and industrial drives to smart-home and IoT devices. OEMs and system designers choose Infineon for its integrated hardware/software solutions, reliability, and global support.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for infineon.
infineon didn’t post a salary, so this is our estimate from similar listings.
17% below the average for this role