Mechanical Simulation Engineer – Advanced Packaging

The Mechanical Simulation Engineer drives thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies, including HBM, 2.5D, and 3D integration. This role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. The position actively integrates Generative AI and AI Assistant tools to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. Collaboration with cross-functional teams is essential to develop predictive simulation methodologies and influence design decisions.