PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)

GlobalFoundries(7 months ago)

SingaporeOnsiteFull TimeSenior$175,685 - $235,684 (estimated)Research & Development

About this role

GlobalFoundries is hiring an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to advance next-generation multi-layer stacking and hybrid bonding development. The role is based in the GF Singapore fabs environment and involves working across internal teams and external partners to bring advanced packaging innovations to product lines and customers. The position also emphasizes technology innovation and IP generation in wafer integration and packaging.

View Original Listing

Required Skills

3DHI
Advanced Packaging
Process Development
Process Integration
Hybrid Bonding
Multi-Die Stacking
Yield Improvement
Failure Analysis
Vendor Management
OSAT Collaboration

+12 more

Qualifications

Master’s in Electrical Engineering
Master’s in Mechanical Engineering
Master’s in Chemical Engineering
Master’s in Materials Science
PhD (Preferred)

About GlobalFoundries

gf.com

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.

View more jobs at GlobalFoundries →