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PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development) at GlobalFoundries - ApplyBlast

PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)

GlobalFoundries

1 year ago

3.5 on Glassdoor

Singapore

Onsite

Full Time

Senior

0 applicants

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About this role

GlobalFoundries is hiring an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to advance next-generation multi-layer stacking and hybrid bonding development. The role is based in the GF Singapore fabs environment and involves working across internal teams and external partners to bring advanced packaging innovations to product lines and customers. The position also emphasizes technology innovation and IP generation in wafer integration and packaging.

Skills

Qualifications

Master’s in Electrical EngineeringMaster’s in Mechanical EngineeringMaster’s in Chemical EngineeringMaster’s in Materials SciencePhD (Preferred)

About GlobalFoundries

gf.com

Headquarters

Malta, New York, United States

Company Size

10001+ employees

Founded

2009

View Profile

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.