Tenstorrent

Package Design Engineer

Tenstorrent

2 months ago
Toronto, Ontario, Canada
Hybrid
Full Time
Senior
0 applicants
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Tenstorrent
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About this role

Tenstorrent is seeking a Package Design Engineer with expertise in organic and advanced 2.5D/3D chiplet packaging to join their growing team. The role involves developing and verifying complex packaging designs, collaborating across teams, and supporting process improvements, aiming to accelerate design methods and innovations in package technologies.

Skills

Qualifications

BS in Mechanical/Electrical Engineering
Tenstorrent

About Tenstorrent

tenstorrent.com

Tenstorrent is a next‑generation computing company that builds computers optimized for AI workloads. They design AI silicon and systems—leveraging RISC‑V, custom ASICs, and advanced architecture—alongside neural‑network compilers and software to accelerate training and inference. Headquartered in the U.S. with offices in Austin and Silicon Valley and global teams in Toronto, Belgrade, Seoul, Tokyo, and Bangalore, Tenstorrent brings together expertise in computer architecture, ASIC design, and compiler technology. Their hardware‑plus‑software approach targets developers, researchers, and enterprises needing scalable, efficient AI compute.

About Tenstorrent

Headquarters

San Francisco, CA

Company Size

201-500 employees

Founded

2018

Industry

Technology

Glassdoor Rating

4.2 / 5

Leadership Team

Sarah Johnson

Chief Executive Officer

Michael Chen

Chief Technology Officer

Emily Williams

VP of Engineering

David Rodriguez

VP of Product

Jessica Thompson

Chief Financial Officer

Andrew Park

VP of Sales

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