Package Design Engineer

Tenstorrent(12 days ago)

HybridFull TimeSenior$100,000 - $500,000Engineering

About this role

Tenstorrent is seeking a Package Design Engineer with expertise in organic and advanced 2.5D/3D chiplet packaging to join their growing team. The role involves developing and verifying complex packaging designs, collaborating across teams, and supporting process improvements, aiming to accelerate design methods and innovations in package technologies.

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Required Skills

chiplet
Packaging
Routing
Design Verification
Automation
Python
TCL
Design Rule Checking
Layout
Scripting

Qualifications

BS in Mechanical/Electrical Engineering

About Tenstorrent

tenstorrent.com

Tenstorrent is a next‑generation computing company that builds computers optimized for AI workloads. They design AI silicon and systems—leveraging RISC‑V, custom ASICs, and advanced architecture—alongside neural‑network compilers and software to accelerate training and inference. Headquartered in the U.S. with offices in Austin and Silicon Valley and global teams in Toronto, Belgrade, Seoul, Tokyo, and Bangalore, Tenstorrent brings together expertise in computer architecture, ASIC design, and compiler technology. Their hardware‑plus‑software approach targets developers, researchers, and enterprises needing scalable, efficient AI compute.

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