Senior Technologist, Advanced Package

Samsung Research America(19 days ago)

United States, San Jose, CA, CaliforniaOnsiteFull TimeSenior$163,000 - $253,000Engineering

About this role

A Senior Advanced Package Technologist acts as the primary technical bridge between strategic datacenter customers and internal engineering teams, defining technical strategy for Datacenter SoC packaging. The role shapes roadmaps for advanced packaging and chiplet architectures (2.5D/3D) and ensures solutions meet the performance demands of next‑generation AI and HPC infrastructure. The position is based at the San Jose headquarters and influences long‑term technology direction and customer engagement.

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Required Skills

Advanced Packaging
Chiplets
2.5D/3D
HBM Integration
TSVs
Hybrid Bonding
Co-Packaged Optics
Optical IO
SI/PI
Technical Leadership

+2 more

Qualifications

BS in Electrical Engineering
BS in Materials Science
BS in Physics
MS in Related Field
PhD in Related Field

About Samsung Research America

samsung.com

Samsung is a global technology company that designs and sells consumer electronics, mobile devices, TVs, home appliances, and related services. In the U.S. it offers Galaxy smartphones and tablets, QLED/OLED and smart TVs, laptops and monitors, plus connected home appliances and IoT integration via SmartThings. Samsung pairs hardware innovation (displays, camera and chipset technology) with software and services to deliver integrated experiences across devices. It sells direct-to-consumer through its website and retail partners while also supplying components and enterprise solutions to industry customers.

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