Package Design Engineer
Kandou
About this role
Kandou is seeking a Package Design Engineer to develop and review IC packaging designs, coordinate with cross-functional teams, and ensure cost-effective and efficient package solutions. The role involves utilizing advanced software tools, understanding IC packaging technologies, and supporting manufacturing processes.
Skills
About Kandou
kandou.aiKandou AI develops chip connection and interconnect technologies that deliver faster, more energy‑efficient data links with a smaller physical footprint than competing solutions. Their IP and link products push the speed‑to‑power trade‑off frontier, lowering power consumption and board area while maintaining high bandwidth. Kandou partners with semiconductor and system companies to integrate these high‑performance, low‑power interconnects into compute, storage, mobile and embedded applications.
About Kandou
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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Salary
$80k – $120k
per year