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© All Rights Reserved. ApplyBlast.com
infineon
This role focuses on defining the package selection strategy, ballout architecture, and IO ring planning for next-generation microcontroller platforms. The position involves analyzing customer PCB design constraints and system-level integration requirements to drive chip-level packaging decisions and verify PHY and PMIC compatibility. The engineer will also drive datasheet content for IO electrical parameters and ensure compliance with ISO 26262 documentation standards.
Infineon Technologies is a global semiconductor company that delivers chips and system solutions for automotive, industrial, IoT, and consumer markets. Its product portfolio includes microcontrollers, sensors, power-management ICs and power semiconductors (e.g., MOSFETs/IGBTs), memories, connectivity (USB, Bluetooth, Wi‑Fi), LED drivers, security controllers and radiation‑hardened devices. Infineon focuses on energy efficiency, safety and security to enable applications from electric vehicles and industrial drives to smart-home and IoT devices. OEMs and system designers choose Infineon for its integrated hardware/software solutions, reliability, and global support.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for infineon.
infineon didn’t post a salary, so this is our estimate from similar listings.
29% below the average for this role
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