Engineer, Advanced Packaging Process and Equipment Technology Development Engineering
Eightfold(25 days ago)
About this role
Micron is seeking an Advanced Packaging Process and Equipment Technology Engineer to join the Advanced Packaging Technology Development (APTD) team to support development and transfer of advanced memory packaging technologies. The role contributes to enabling high-performance assembly solutions that drive AI, supercomputing, and next-generation memory products. The position sits within Micron’s engineering organization focused on innovation in memory and storage manufacturing.
Required Skills
- Process Development
- Wafer Packaging
- Die Stacking
- Yield Improvement
- Cost Reduction
- Equipment Evaluation
- Materials Evaluation
- Process Parameters
- DOE
- SPC
+6 more
Qualifications
- B.S./M.S./Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or Physics
About Eightfold
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