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Principal Packaging Integration Engineer (2026 New College Graduate) at GlobalFoundries - ApplyBlast

Principal Packaging Integration Engineer (2026 New College Graduate)

GlobalFoundries

4 months ago

3.5 on Glassdoor

Essex Junction, VT

Onsite

Full Time

Senior

0 applicants

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About this role

GlobalFoundries seeks an Assembly Process Integration Engineer to deliver industry-leading electro-optical transceivers using Photonix platform and advanced 2.5D/3D co-packaged optics form factors. The role requires a strong focus on tool-process interactions within SiPh Flip Chip assembly, prioritizing product reliability, packaging design rules, and stress planning for chiplet modules. Candidates will define process integration specifications, establish design rules, and collaborate with OSAT ecosystems to drive manufacturing innovations.

Responsibilities

Define process integration specifications for co-packaged optics modules
Establish manufacturing-driven design rules and standards
Conduct failure analysis and design of experiments for reliability
Collaborate with cross-functional teams to resolve technical yield concerns
Drive continuous improvement plans for packaging qualification processes

Skills

Qualifications

PhD in Materials Science or related fieldMS with 2+ years of experience in semiconductor manufacturingCertification in Quality Management (e.g., Six Sigma)

About GlobalFoundries

gf.com

Headquarters

Malta, New York, United States

Company Size

10001+ employees

Founded

2009

View Profile

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.