ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
Renesas 瑞萨电子
The role involves designing and developing packaging and interconnect methods for power SiP/modules, wafer level, flip-chip, and multi-chip module solutions at Renesas. The engineer will work with OSAT/CM partners to qualify materials, processes, and assemblies, ensure smooth production transitions, and address integration and quality issues.
作为全球领先的微控制器、模拟功率器件和SoC产品供应商，瑞萨电子通过提供可靠的创新嵌入式设计，与您共创无限未来。
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Renesas 瑞萨电子.
Renesas 瑞萨电子 didn’t post a salary, so this is our estimate from similar listings.
13% above the average for this role
Process Integrator for Advanced Package Assembly for Heterogeneous Integration
ASTARPRD
Advanced Packaging Process Engineer
Micron Technology
Scientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration
ASTARPRD
Senior/Staff Process Engineer (Wafer Dicing & Back-grind)
Lumilens
Senior Technical Lead - RF Front End Packaging
Qualcomm Incorporated
Packaging Module Development Engineer
Intel