Micron Technology
The Senior Advanced Assembly Technology Development Engineer will lead the introduction of new packaging technologies, including flip chip, TCB, and hybrid bonding, by developing processes, building DOE samples, and transferring technology from development to high‑volume manufacturing. The role collaborates with material, bumping, NPI, quality, and manufacturing teams to ensure successful process implementation and continuous improvement.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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Micron Technology didn’t post a salary, so this is our estimate from similar listings.
21% below the average for this role
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