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© All Rights Reserved. ApplyBlast.com
Ranovus
The Principal Advanced Optical Packaging Engineer will develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity, overseeing package architecture, flip-chip and BGA assembly, laser integration, fiber attach, and thermal-mechanical risk management. The role involves leading NPI, qualification, and manufacturing transfer activities while collaborating with design teams, equipment developers, suppliers, and manufacturing partners.
Ranovus architects optical infrastructure for AI, delivering silicon photonics-based co-packaged optics (CPO) and near-package optics (NPO) designed for XPU and switch architectures in large-scale AI compute clusters. The company's platform combines proprietary Quantum Dot and Quantum Well Lasers, RAMZI Modulators, and monolithic integration to achieve multi-terabit optical engines with industry-leading power efficiency and shoreline density. Ranovus operates an end-to-end engagement model spanning silicon photonics design, semiconductor foundry collaboration, advanced packaging, and high-volume manufacturing to accelerate hyperscaler adoption.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Ranovus.
Ranovus didn’t post a salary, so this is our estimate from similar listings.
50% above the average for this role
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