Process Engineering / Assembly Engineering

This role requires a professional with 10-15 years of experience in process or assembly engineering within the semiconductor industry, specifically focusing on die bond and wire bond processes in high-volume production. The position demands strong analytical and troubleshooting skills to effectively resolve production issues, alongside supervisory and management capabilities. Candidates must possess a solid understanding of LEAN, SIX SIGMA, SPC, and MSA methodologies, with a good command of the English language.