GlobalFoundries
A Senior R&D Engineer at GlobalFoundries Fab8 leading advanced 3D heterogeneous integration initiatives within the Advanced Packaging Lab. The role focuses on developing wafer- and die-level 2.5D/3D packaging technologies to enable GlobalFoundries product lines. The position involves cross-functional collaboration with internal teams, tool and material vendors, and external partners to advance integration capabilities and support early product prototyping.
Headquarters
Malta, New York, United States
Company Size
10001+ employees
Founded
2009
GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for GlobalFoundries.
GlobalFoundries Announces Secondary Public Offering of 20 Million Shares and $300 Million Share Repurchase Initiative
18 hours ago
Scientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration
ASTARPRD
Process Integrator for Advanced Package Assembly for Heterogeneous Integration
ASTARPRD
Research Engineer or Senior Research Engineer
ASTARPRD
Principal / Senior Principal Scientist (Lead, 3D IC Package Integration), Advanced Packaging
ASTARPRD
Scientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration
ASTARPRD
MTS Process Integration Engineer | APTD Die Level Technology
Micron Technology