R&D Engineer IC Design
Broadcom(3 months ago)
About this role
Broadcom’s Core Switching Group is hiring an experienced engineer to develop advanced silicon interposer designs for industry-leading network switches used in enterprise and hyperscale data centers. The role focuses on cutting-edge CoWoS 2.5D/3D integration work across interposer design through foundry tapeout, partnering with internal and external stakeholders across the packaging ecosystem.
Required Skills
- Advanced Packaging
- Interposer Design
- CoWoS
- 2.5D Integration
- 3D Integration
- TSV Design
- Micro-Bumps
- Solder Bumps
- High-Speed Routing
- Bump Map Design
+16 more
Qualifications
- BS in Electrical Engineering
- BS in Microelectronics
- MS Degree
About Broadcom
broadcom.comBroadcom Inc. is a global technology leader that designs, develops, and supplies a comprehensive range of semiconductor and enterprise software solutions. The company's offerings include a variety of security solutions and products aimed at enhancing connectivity across various sectors. With a commitment to innovation and quality, Broadcom is at the forefront of driving technological advancements that connect everything, from data centers to mobile devices.
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