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© All Rights Reserved. ApplyBlast.com
ASTARPRD
The Heterogeneous Integration Department at the Institute of Microelectronics is seeking a Research Engineer or Senior Research Engineer to advance chip-to-wafer and wafer-to-wafer hybrid bonding processes. This role involves developing fabrication techniques for 2.5D and 3D packaging applications and conducting electrical and reliability characterization. The position offers the opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for ASTARPRD.
ASTARPRD didn’t post a salary, so this is our estimate from similar listings.
31% below the average for this role