Packaging Engineer E5
Applied Materials(25 days ago)
About this role
Applied Materials is hiring an experienced engineering professional to join its Advanced Semiconductor Packaging team in Santa Clara, developing new packaging modules and driving technology roadmaps. The role focuses on advancing wafer-to-wafer bonding and heterogeneous packaging solutions through cross-functional collaboration and technical leadership. Candidates will work on module definition, characterization, and patentable innovations to support Applied’s packaging product portfolio.
Required Skills
- Program Management
- Timeline Management
- Budget Management
- Interpersonal Skills
- Leadership
- Written Communication
- Thermal Management
- Wafer Bonding
- Heterogeneous Packaging
- TSV
+5 more
Qualifications
- MS in Electrical, Mechanical, or Materials Engineering
- PhD in Electrical, Mechanical, or Materials Engineering
About Applied Materials
appliedmaterials.comApplied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.
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