Semiconductor Assembly Process Development Engineer

This role focuses on technology development for semiconductor back-end processes, including assembly, packaging, and testing, with a strong emphasis on next-generation packaging technologies like Flip Chip and System-in-Package. The position involves developing and evaluating advanced packaging solutions such as FCCSP and FCBGA to support high-density, high-reliability applications in AI, HPC, automotive, and IoT sectors. The engineer will drive process quality improvements, yield enhancement, and the transition of new technologies to mass production.