ASTARPRD
This role focuses on the development, validation, and deployment of advanced packaging design enablement research, including 2.5D interposer, 3D hybrid bonding, and 3.5D large package reference flows. The position involves creating robust design infrastructures and automated methodologies to accelerate the adoption of advanced packaging technologies across AI, HPC, networking, mobile, and automotive applications. Success is measured by the delivery of qualified PDKs, successful flow deployment, and improved design productivity.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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