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© All Rights Reserved. ApplyBlast.com
Nexperia
The Senior Equipment Engineer (Wire Bond) is responsible for sustaining, optimizing, and continuously improving Wire Bond manufacturing equipment to support production, quality, yield, and cost targets within a high-volume semiconductor manufacturing environment. The role involves leading troubleshooting and root cause analysis to minimize downtime, driving equipment reliability and OEE improvement initiatives, and implementing preventive and predictive maintenance programs. This position requires close collaboration with cross-functional teams to resolve equipment challenges and support automation and digitalization efforts.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Nexperia.
Nexperia didn’t post a salary, so this is our estimate from similar listings.
40% below the average for this role
Nexperia China says it has begun producing its own chips
2 days ago
