Senior Mechanical Engineer - Microelectronics Packaging (Onsite)

Mechanical Engineer in the Applied Research and Technology (ART) Microelectronics Packaging Group at Collins Aerospace responsible for advancing microelectronics packaging technologies and developing miniaturized electronic devices for aerospace and defense applications. The role is based in Cedar Rapids, IA and requires U.S. citizenship and an active DoD Secret clearance. The position supports technology maturation, prototyping, and transition of designs into manufacturing.