Senior Mechanical Engineer - Microelectronics Packaging (Onsite)

RTX(25 days ago)

Cedar Rapids, IAOnsiteFull TimeSenior$86,800 - $165,200Applied Research and Technology

About this role

Mechanical Engineer in the Applied Research and Technology (ART) Microelectronics Packaging Group at Collins Aerospace responsible for advancing microelectronics packaging technologies and developing miniaturized electronic devices for aerospace and defense applications. The role is based in Cedar Rapids, IA and requires U.S. citizenship and an active DoD Secret clearance. The position supports technology maturation, prototyping, and transition of designs into manufacturing.

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Required Skills

Mechanical Design
Thermal Analysis
Structural Analysis
CAD
SolidWorks
ANSYS
Prototyping
Failure Analysis
Manufacturing Support
Signal Integrity

Qualifications

BS in STEM
Advanced Degree
Active DoD Secret Clearance
U.S. Citizenship

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