Senior Package Design Engineer

The Senior Package Design Engineer role focuses on advancing technological innovation in semiconductor package assembly, particularly for next-generation packaging technologies like PowerQFN, Flip-Chip, and SiP. The position involves designing and developing package and interconnect methods for AI/HPC, VPD, and other high-demand markets while collaborating with cross-functional teams to optimize processes and ensure smooth production transitions. This role requires expertise in advanced packaging technologies and strong analytical skills to address customer needs and drive business growth.