Senior Wire Bond Equipment & Process Engineer

Nexperia(26 days ago)

Seremban, MalaysiaOnsiteFull TimeSenior$100,466 - $137,424 (estimated)Process Engineering

About this role

A Senior Wire Bond Equipment & Process Engineer at Nexperia specializes in wire bonding technology within semiconductor manufacturing, focusing on maintaining manufacturing quality and reliability. The role works with cross-functional teams including R&D, process engineering, and manufacturing to support product and process development.

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Required Skills

Wire Bonding
Thermosonic Bonding
Ultrasonic Bonding
Gold Bonding
Copper Bonding
ASM Bonders
Bonder Programming
Process Optimization
Troubleshooting
DOE

+10 more

Qualifications

Bachelor's Degree in Electrical/Electronic Engineering
Bachelor's Degree in Mechanical Engineering
Bachelor's Degree in Materials Science

About Nexperia

nexperia.com

Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.

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