SMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)

GlobalFoundries(7 months ago)

SingaporeOnsiteFull TimeSenior$176,773 - $237,409 (estimated)Research & Development

About this role

GlobalFoundries is hiring an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive thermal solutions for next-generation hybrid bonding development. The role is based in Singapore and supports advanced packaging technology development in a high-volume semiconductor foundry environment. The position involves working cross-functionally with internal fab/product teams and external partners to enable new capabilities and product readiness.

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Required Skills

3D Integration
Heterogeneous Integration
Thermal Solutions
Hybrid Bonding
Process Development
Process Integration
Advanced Packaging
Multi-Die Stacking
Yield Improvement
Failure Analysis

+10 more

Qualifications

Master’s in Electrical Engineering
Master’s in Mechanical Engineering
Master’s in Chemical Engineering
Master’s in Materials Science
PhD (Preferred)

About GlobalFoundries

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GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.

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