SR ENGINEER, APTD Bonding / Wafer Thinning
Eightfold(1 month ago)
About this role
Micron Technology is seeking a professional to drive improvements in wafer bonding/debonding and wafer thinning performance. The role involves coordinating experiments for technology development and yield improvement, providing technical consultancy for advanced packaging technologies, and troubleshooting complex engineering issues.
Required Skills
- Wafer Bonding
- Process Engineering
- Materials Characterization
- Technical Documentation
- Troubleshooting
Qualifications
- Master's Degree
- PhD (plus)
- 3 Years Experience
About Eightfold
eightfold.aiMaximize your workforce's potential with our advanced AI Talent Intelligence Platform for talent acquisition and development. Unlock the full potential of your workforce today.
View more jobs at Eightfold →Apply instantly with AI
Let ApplyBlast auto-apply to jobs like this for you. Save hours on applications and land your dream job faster.
More jobs at Eightfold
Similar Jobs
CVD Process Engineer - Wafer Bonding
Samsung Research America(5 months ago)
Packaging Engineer E5
Applied Materials(26 days ago)
PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)
GlobalFoundries(7 months ago)
Wire Bonding Technician
Anduril Industries(1 month ago)
Wire Bonding Technician
Anduril Industries(20 days ago)
Wire Bonding Technician
Anduril Industries(11 hours ago)