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© All Rights Reserved. ApplyBlast.com
Renesas 瑞萨电子
The Sr Process Engineer role focuses on technology development for advanced semiconductor packaging solutions, including Flip Chip Chip Scale Package (FCCSP), Flip Chip Ball Grid Array (FCBGA), and power semiconductor packages, targeting AI, HPC, automotive, and IoT applications. The position involves leading assembly technology development, equipment selection and introduction, material and process optimization, and supporting manufacturing line startup and mass production transition. This role contributes to enhancing the competitiveness of semiconductor products for future AI and autonomous driving societies.
作为全球领先的微控制器、模拟功率器件和SoC产品供应商，瑞萨电子通过提供可靠的创新嵌入式设计，与您共创无限未来。
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for Renesas 瑞萨电子.
Renesas 瑞萨电子 didn’t post a salary, so this is our estimate from similar listings.
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