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© All Rights Reserved. ApplyBlast.com
Qualcomm Incorporated
This role involves supporting the development of advanced semiconductor products and technologies, including bumping, WLP, Flip Chip, and 2.5/3D Chiplet applications. The position requires cross-functional collaboration to manage product material selections, technical risk assessments, and development from concept to production. Candidates will work closely with design, device process development, and packaging groups to ensure process capability and reliability.
Headquarters
San Diego, California, United States
Company Size
10001+ employees
Founded
1985
Qualcomm is a global semiconductor and telecommunications company that designs wireless technologies and platform solutions, best known for its Snapdragon mobile SoCs, 5G modems, and RF front‑end components. The company focuses on high‑performance, low‑power computing and on‑device AI, as well as unrivaled connectivity to enable smartphones, automotive systems, XR, IoT, and edge applications. Qualcomm pairs chip design and system software with extensive patent licensing and a broad OEM/developer ecosystem to accelerate industry transformation through 5G, AI, and “intelligent computing everywhere.”
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Qualcomm Incorporated.